You’re Invited! Meet Cyklop at PACK EXPO Chicago 2026

Let’s meet in Chicago and shape the future of packaging together!

The countdown is on — and we’d love to see you there!

Join Cyklop at PACK EXPO Chicago 2026 and discover how smarter packaging solutions can help you make your processes more efficient, reliable, and future-ready.

Visit us at Booth S-4172 in the South Building to experience our latest technologies, see live demonstrations, meet our packaging experts, and explore solutions designed around your challenges.

October 18–21, 2026

McCormick Place | Chicago, Illinois
Cyklop – South Building | Booth S-4172

We’d be delighted to welcome you to PACK EXPO Chicago.

Your invitation includes a guest code.

Use your Cyklop guest code:

40R44 when registering for the show.

Register NOW

BOOK A MEETING / CONTACT OUR TEAM

Don’t miss the opportunity to connect with the Cyklop team and experience our solutions live.

Discover. Experience. Connect.

There’s no better way to see what’s possible than experiencing it firsthand.

Stop by our booth and:

• Discover our latest packaging technologies and solutions

• Experience live demonstrations in action

• Connect with our packaging experts

• Discuss your individual packaging challenges

• Explore ways to improve efficiency, reliability, and performance

• Find the right solutions tailored to your requirements

Whether you’re looking to optimize an existing packaging process or exploring new possibilities, our team is ready to share ideas and help you find the right approach.

Want to make the most of your visit?

Schedule a personal meeting with the Cyklop team in advance and take the opportunity to discuss your specific requirements, projects, and packaging challenges with our experts.

PACK EXPO is the perfect place to discover what’s next in packaging — and we’d love for Cyklop to be part of your visit.

See you at PACK EXPO Chicago 2026!
Your Cyklop Team

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